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CEO

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CTI Project – Novel laser processing machines

The main goal of this project is the development of laser processing machines to process complex PCD/CVD-D/CBN cutting tools by means of a novel dual laser processing head concept.

The development of these laser processing machines will lead to the rapid processing of PCD/CVD-D/CBN cutting tools using two processing heads. Thus, the processing time will be reduced significantly. To achieve this, accelerated material removal of the tool’s contour is carried out by a cutting head using a nanosecond laser. Subsequently, ultrafine finishing of the tool’s contour and chip breaker is carried out using a picosecond laser. A new modular machine generation will be developed which adopts this duality concept.

Coordinator:
ETH Zürich, CH

Partners:

Funded Project




AreaLife Sciences, ICT
ProgrammeHORIZON-EIC-2021-PATHFINDEROPEN
Duration01.04.2022 – 31.03.2026
Budget3 million euro
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