The main goal of this project is the development of laser processing machines to process complex PCD/CVD-D/CBN cutting tools by means of a novel dual laser processing head concept.
The development of these laser processing machines will lead to the rapid processing of PCD/CVD-D/CBN cutting tools using two processing heads. Thus, the processing time will be reduced significantly. To achieve this, accelerated material removal of the tool’s contour is carried out by a cutting head using a nanosecond laser. Subsequently, ultrafine finishing of the tool’s contour and chip breaker is carried out using a picosecond laser. A new modular machine generation will be developed which adopts this duality concept.Coordinator:
ETH Zürich, CH
- inspire AG, CH
- EWAG AG, CH